Photos: Technicolor wafers star on IDF floor
This is a close-up of a close-up picture of the vias in the 80-core chips. Data travels between the processor and memory through thousands of dedicated channels.
The process, called through-silicon vias, involves stacking chips vertically in a package and then creating connections between the bottom of the top chip and the top of the bottom chip. TSV, which Intel discussed in March of 2005, will greatly speed up processing.
